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* The scription of symbols

CJ
 Junction Capacitance
TA
 Ambient Temperature
IF
 DC Forward Rectified Current
TC
 Case Temperature
I[AV]
 Average Forward Rectified Current
Td
 Time Duration
IBO
 Break over Current
Tf
 Fall Time
ID
 Stand-by Reverse Leakage Current
TJ
 Junction Temperature
IFSM
 Peak Forward Surge Current
tL
 Lead Temperature
IH
 Holding Current
tfr
 Forward Recovery time
IO
 Mean Forward Current
tr
 Rise Time
IR
 Reverse Leakage Current
Trr
 Reverse Recovery Time
Irr
 Reverse Recovery Current
VSTG
 Storage Temperature
IPPM
 Maximum Peak Impulse Current
VBO
 Break over Voltage
IRM(REC)
 Maximum Peak Reverse Recovery Current
V(BR)
 Reverse Breakdown Voltage
IRSM
 Maximum Non-Repetitive Reverse Peak Current
VF
 Instantaneous Forward Voltage
It
 On-State Test Current
Vfr VR
 Forward Recovery Voltage
ITRM
 Repetitive Peak on-state Current
VDC
 DC Reverse Voltage
ITSM
 Peak One Cycle Sine-Wave Surge Current
VO
 Output Voltage
RM(AV)
 Maximum Steady State Power Dissipation
VRM
 Maximum Recurrent Peak Reverse Voltage
PPM
 Peak Pulse Power Dissipation
VRMS
 RMS Input Voltage
PC
 Power Dissipation on Printed Circuit
VRRM
 Peak Repetitive Reverse Voltage
Qrr
 Recovered Charge
VRWM
 Working Peak Reverse Voltage (Stand-off Voltage)
R¥èJA
 Thermal Resistance (Junction to Ambient)
VTM
 Peak On-State Voltage
R¥èJC
 Thermal Resistance (Junction to Case)
VZ
 Zener Voltage
R¥èJL
 Thermal Resistance (Junction to Lead)
ZK
 Dynamic Impedance

* Temperatures : Ratings at 25¡É ambient temperature unless otherwise specified.

* Drawings : All dimensions are in inches and (millimeters) unless noted otherwise. Figures not to
                         scale.