CJ |
Junction Capacitance |
TA |
Ambient Temperature |
IF |
DC Forward Rectified Current |
TC |
Case Temperature |
I[AV] |
Average Forward Rectified Current |
Td |
Time Duration |
IBO |
Break over Current |
Tf |
Fall Time |
ID |
Stand-by Reverse Leakage Current |
TJ |
Junction Temperature |
IFSM |
Peak Forward Surge Current |
tL |
Lead Temperature |
IH |
Holding Current |
tfr |
Forward Recovery time |
IO |
Mean Forward Current |
tr |
Rise Time |
IR |
Reverse Leakage Current |
Trr |
Reverse Recovery Time |
Irr |
Reverse Recovery Current |
VSTG |
Storage Temperature |
IPPM |
Maximum Peak Impulse Current |
VBO |
Break over Voltage |
IRM(REC) |
Maximum Peak Reverse Recovery Current |
V(BR) |
Reverse Breakdown Voltage |
IRSM |
Maximum Non-Repetitive Reverse Peak Current |
VF |
Instantaneous Forward Voltage |
It |
On-State Test Current |
Vfr VR |
Forward Recovery Voltage |
ITRM |
Repetitive Peak on-state Current |
VDC |
DC Reverse Voltage |
ITSM |
Peak One Cycle Sine-Wave Surge Current |
VO |
Output Voltage |
RM(AV) |
Maximum Steady State Power Dissipation |
VRM |
Maximum Recurrent Peak Reverse Voltage |
PPM |
Peak Pulse Power Dissipation |
VRMS |
RMS Input Voltage |
PC |
Power Dissipation on Printed Circuit |
VRRM |
Peak Repetitive Reverse Voltage |
Qrr |
Recovered Charge |
VRWM |
Working Peak Reverse Voltage (Stand-off Voltage) |
R¥èJA |
Thermal Resistance (Junction to Ambient) |
VTM |
Peak On-State Voltage |
R¥èJC |
Thermal Resistance (Junction to Case) |
VZ |
Zener Voltage |
| R¥èJL |
Thermal Resistance (Junction to Lead) |
ZK |
Dynamic Impedance |
